Fabrication process: lithography, etching basics
VLSI Design · Engineering
Study notes
Chip: wafer; photoresist + UV mask patterns; etch removes; implant dopes; deposit metal; repeat 100s layers. 3nm: EUV lithography. Fab costs billions.
One notebook for every subject — open it anywhere.
VLSI Design · Engineering
Chip: wafer; photoresist + UV mask patterns; etch removes; implant dopes; deposit metal; repeat 100s layers. 3nm: EUV lithography. Fab costs billions.